191101-Design files of outer hybrids (v2.3)
Updated on Sun, 2019-11-10 22:20. Originally created by jndong on 2019-10-31 20:32.
Modification: Address connection for the temperature sensor chip (U1:TMP102->PIN 4:ADD0) on outer hybrid, modified from GND to SCL.
Reason: "There are TMP102 temperature sensors on the inner hybrid, outer hybrid, T-Board, and Patch Panel Board, all tied to the same I2C line. PPB has address tied to SDA. T-Board has it tied to VSS. Inner Hybrid tied to V+/VDDa." (From Mike).
As there are four kinds of address connections for TMP102, Out hybrid must tied it to SCL..
Status: The design for outer hybrid are modified and updated.
Attached files: schematic, layout, gerber and project design files
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