20191126: Layout for outer hybrid (v2.3) is improved and updated. 

Modification:  improve the power plane and power vias

Reason: improve the "impedance of power routing on the hybrid", move "the temperature sensor closer to one of the middle APV chips", delete the "long skinny bit of top coverlayer" (From Gerard)  

Status: The layout for v2.3 outer hybrid is improved and updated.
             The latest output files included schematic, assembly drawings, CAD, BOM, and gerber files can be found in the attachment.