Design files of outer hybrids (v2.3)
Updated on Tue, 2019-10-29 01:03. Originally created by jndong on 2019-10-28 21:41.
Modification: Address connection for the temperature sensor chip (U1:TMP102->PIN 4:ADD0) on outer hybrid, modified from V+ to GND.
Reason: Two temperature sensor chips are placed on the inner hybrid and outer hybrid respectivily.
The inner hybrid and outer hybrid will be connected to ONE T-board for singal transmission.
So the address for the two temperature sensor chips must be different.
As the address pin on the inner hybrid is connected to V+, that on the outer hybrid can be connected to GND.
Results: The design for outer hybrid are updated to v2.3.
Attached files: schematic, layout, gerber and project design files
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