20200813: Layout for inner hybrid (v3) are improved and updated. 

Modification:  change the connection between pads and copper from the normal pad to thermal pad.

Reason: easy soldering  

Status: The layout for v3 inner hybrid is improved and updated.
             The dimensions (shape, size, positions of APV, sensors, and APV bonding pads and sensor HV bias pads) in v3 are unchanged w.r.t. v2.3. 
             The latest output files included assembly drawings, CAD, and gerber files can be found in the attachment.