Measurements of hybrid from old and new vendor

Test items:
1. Flatness
flatness of the top layer, we put the hybrid on the platform and use blocks(steel) on top of it, and then use laser to take points.

2. Thickness
thickness of the hybrid.
Since the hybrid is not uniform, the thickness test measure the sensor area and the readout area separetely.

3. Pad location test
Two reference holes A and B as Yi suggested.
Set AB as the x axis and the line perpendicular to AB is Y axis.
Set A as the origin (0,0). Measure the pads from chip 1, 2, 3, 4.

4. Outline
We measure the outline of the hybrid, which involves the length and width.

5. Chip location test
Set AB as the x axis and the line perpendicular to AB is Y axis.
Set A as the origin (0,0). We measure the four corner of the chips.

For the reference holes A and B, the coordinates in CAD.
Inner: A(0,0) B(68.428, -1.498)  AB = 68.44 mm
Outer: A(0,0) B(117.374, 0.762)  AB = 117.38 mm