Inner TPC Electronics Upgrade

 

SAMPA Chip: the New 32 Channels ASIC for the ALICE TPC and MCH Upgrades

Purpose: Design a higher density FEE cards based on the SAMPA ASIC developed for ALICE. The present FEE cards use 16 channel per-amplifier ASICS that are then digitized using semi-custom die's from ST Microelectronics (ADC's).

The new FEE called "iFEE" (used on inner sector of STAR TPC upgrade), is sometimes referred to as "HD-FEE" since this new design will have 64 channels as opposed to the current FEE cards 32 channels.

High speed readout:
The readout from the SAMPA chips is multiplexed from an FPGA (Xilinx SPARTAN 6).

 

The project was broken into two Design and Manufacturing processes:

FPGA (Firmware)
FPGA firmware design for production: Tonko Ljubicic, BNL

FPGA test and development firmware: Tonko Ljubicic, BNL

Circuit design (schematic) and PCB Design: Tim Camarda, BNL

iFEE 64 channel Prototype
64 Channel iFEE prototype 2015


2017 Testing AKA Run 2 (2017):

- SAMPA configuration jumpers omitted. Configuration is now dynamic from FPGA control.