Inner TPC Electronics Upgrade
SAMPA Chip: the New 32 Channels ASIC for the ALICE TPC and MCH Upgrades
Purpose: Design a higher density FEE cards based on the SAMPA ASIC developed for ALICE. The present FEE cards use 16 channel per-amplifier ASICS that are then digitized using semi-custom die's from ST Microelectronics (ADC's).
The new FEE called "iFEE" (used on inner sector of STAR TPC upgrade), is sometimes referred to as "HD-FEE" since this new design will have 64 channels as opposed to the current FEE cards 32 channels.
High speed readout:
The readout from the SAMPA chips is multiplexed from an FPGA (Xilinx SPARTAN 6).
The project was broken into two Design and Manufacturing processes:
FPGA (Firmware)
FPGA firmware design for production: Tonko Ljubicic, BNL
FPGA test and development firmware: Tonko Ljubicic, BNL
Circuit design (schematic) and PCB Design: Tim Camarda, BNL
64 Channel iFEE prototype 2015
2017 Testing AKA Run 2 (2017):
- SAMPA configuration jumpers omitted. Configuration is now dynamic from FPGA control.
- timcam's blog
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